发明名称 |
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ROUNDED INTERCONNECT |
摘要 |
An integrated circuit packaging system includes: a package carrier; an integrated circuit attached to the package carrier; a rounded interconnect on the package carrier; and an encapsulation over the package carrier covering the integrated circuit and exposing the rounded interconnect having a characteristic free of denting.
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申请公布号 |
US2012025374(A1) |
申请公布日期 |
2012.02.02 |
申请号 |
US201113272034 |
申请日期 |
2011.10.12 |
申请人 |
BAE JOHYUN;CHOI DAESIK;CHO SUNGWON |
发明人 |
BAE JOHYUN;CHOI DAESIK;CHO SUNGWON |
分类号 |
H01L23/498 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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