发明名称 MANGANESE OXIDE FILM FORMING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
摘要 There is provided a manganese oxide film forming method capable of forming a manganese oxide film having high adhesivity to Cu. In the manganese oxide film forming method, a manganese oxide film is formed on an oxide by supplying a manganese-containing gas onto the oxide. A film forming temperature for forming the manganese oxide film is set to be equal to or higher than about 100° C. and lower than about 400° C.
申请公布号 US2012025380(A1) 申请公布日期 2012.02.02
申请号 US201113267227 申请日期 2011.10.06
申请人 NEISHI KOJI;KOIKE JUNICHI;MATSUMOTO KENJI;TOHOKU UNIVERSITY;TOKYO ELECTRON LIMITED 发明人 NEISHI KOJI;KOIKE JUNICHI;MATSUMOTO KENJI
分类号 H01L23/532;B05D5/12;H01L21/283 主分类号 H01L23/532
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