发明名称 FILM WITH ATTACHED METAL LAYER FOR ELECTRONIC COMPONENTS, PRODUCTION METHOD THEREOF, AND APPLICATIONS THEREOF
摘要 Disclosed are a metal layer-attached film for an electronic component having an adhesive layer excellent in adhesion to a metal and excellent in the productivity, a method for producing the film, and use application of the film. The metal layer-attached film for an electronic component has a metal layer stacked on at least one surface of a resin film through an adhesive layer, wherein the adhesive layer contains an ethylene-unsaturated carboxylic acid copolymer or a metal salt thereof.
申请公布号 EP2412519(A1) 申请公布日期 2012.02.01
申请号 EP20100755644 申请日期 2010.03.23
申请人 DU PONT-MITSUI POLYCHEMICALS CO., LTD. 发明人 MAKI, NOBUYUKI;HASHIMOTO, HIDENORI;YAMAMOTO, YOSHIMASA
分类号 B32B15/08;B32B7/12;B32B27/08;H01L21/60;H01Q1/38;H05K1/03;H05K3/00;H05K9/00 主分类号 B32B15/08
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