发明名称 |
FILM WITH ATTACHED METAL LAYER FOR ELECTRONIC COMPONENTS, PRODUCTION METHOD THEREOF, AND APPLICATIONS THEREOF |
摘要 |
Disclosed are a metal layer-attached film for an electronic component having an adhesive layer excellent in adhesion to a metal and excellent in the productivity, a method for producing the film, and use application of the film. The metal layer-attached film for an electronic component has a metal layer stacked on at least one surface of a resin film through an adhesive layer, wherein the adhesive layer contains an ethylene-unsaturated carboxylic acid copolymer or a metal salt thereof. |
申请公布号 |
EP2412519(A1) |
申请公布日期 |
2012.02.01 |
申请号 |
EP20100755644 |
申请日期 |
2010.03.23 |
申请人 |
DU PONT-MITSUI POLYCHEMICALS CO., LTD. |
发明人 |
MAKI, NOBUYUKI;HASHIMOTO, HIDENORI;YAMAMOTO, YOSHIMASA |
分类号 |
B32B15/08;B32B7/12;B32B27/08;H01L21/60;H01Q1/38;H05K1/03;H05K3/00;H05K9/00 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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