| 摘要 |
One aspect of the present invention relates to a molding system for use in packaging integrated circuits. The molding system includes a top cavity bar, a middle cavity bar, a bottom cavity bar, a tape and an injection unit. When an electronic substrate is positioned between the top and middle cavity bars, the top and middle cavity bars are arranged to sandwich the electronic substrate. The top and middle cavity bars are also arranged to help form one or more mold cavities over device areas of the electronic substrate. The tape is positioned below the middle cavity bar and is arranged to cover and relieve pressure on a bottom of each mold cavity. The bottom cavity bar is positioned below the tape and is arranged to support the tape. The injection unit is arranged to inject a molding material into the mold cavities.
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