| 摘要 |
<p>The embrittlement layer and the semiconductor layer remaining on the periphery of the semiconductor substrate after separation are selectively removed using a mixed solution containing a substance functioning as an oxidizer for oxidizing a semiconductor, a substance dissolving an oxide of a semiconductor, and a substance functioning as a decelerator of oxidization of a semiconductor and dissolution of an oxide of a semiconductor. Note that the semiconductor film is separated from the semiconductor substrate along an embrittlement layer that is formed in the semiconductor substrate by implantation of an H+ ion generated from a hydrogen gas with use of an ion implantation apparatus.</p> |
