发明名称 SINGLE-SIDED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
摘要 <p>A single-sided circuit board is manufactured by hot pressing an insulation layer on the both sides of the compressed lead simultaneously. At the last moulding stage,the place of the compressed lead to be cut is removed. So that two paratactic compressed leads are formed to be a circuit layer. Bridge piece connection is connected by using printed conductive ink or jointing conductor. Jack elements are mounted by directly drilling or punching by mould at the welding dot. The method can manufacture the circuit board with no need of etching. It has short production flow and high efficiency. The method is a new technique which is environmental friendly, energy saving and material saving.</p>
申请公布号 WO2012009839(A1) 申请公布日期 2012.01.26
申请号 WO2010CN02145 申请日期 2010.12.24
申请人 WANG, DINGFENG;XU, WENHONG 发明人 WANG, DINGFENG;XU, WENHONG
分类号 H05K3/00 主分类号 H05K3/00
代理机构 代理人
主权项
地址