| 摘要 |
<p>A method for fabricating a single-sided circuit board using apposition flat wires (2) is provided. The method comprises: after thermo-compressing a cover film (3) including pad windows with the apposition flat wires (2) directly, cutting the flat wires (2) at the position where need to be disconnected, and then laminating together with the adhesive circuit board substrate (1), achieving the bridge connection by printing conductive inks or soldering conductors. At the same time of printing characters, the inks are filled in cutting openings (14) of the cover film and the flat wires, so as to insulate the exposed wires at the cutting openings. And insert components can be welded by directly drilling or punching using the mold at the welding points. The circuit board can be fabricated by using this method without etching process, and the method is a new technology of environmental-protection, energy-conserving, and material-saving.</p> |
