ANTI-OXIDATION METHOD FOR MULTILAYER WIRING OF ULTRA LARGE SCALE INTEGRATED CIRCUIT AFTER ALKALINE POLISHING

摘要

An anti-oxidation method for multilayer wiring of an ultra large scale integrated circuit after alkaline polishing is provided. The method includes the following steps: (1) preparing an anti-oxidation liquid; (2) water polishing by the prepared anti-oxidation liquid under a condition for the low pressure of 1000-2000Pa and large flow of 2000-5000ml/min for 0.5-1 minute to form a passivation layer on a surface of the multilayer wiring. The method effectively prevents fresh copper from being oxidized after polishing so as to achieve a clean and perfect polishing surface.