METHOD FOR MANUFACTURING WIRING BOARD AND WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a wiring board in which delamination or the like is hard to occur in the vicinity of an interface between an insulating layer and an electrode pad formed in a recess of the insulating layer.

SOLUTION: An adjustment layer 53 for adjusting a shape of an electric pad 23 is formed in an opening 52 of a resist 51 formed on a support body 50. The adjustment layer 53 includes: a flat surface 53a substantially parallel to the support body 50; and an inclined surface 53b extended from an outer edge of the flat surface 53a to a side wall of the opening 52 toward the side of the support body 50. A pad body 24 of the electrode pad 23 is formed on the adjustment layer 53 to form the insulating layer and a wiring layer. The pad body 24 is exposed by etching the support body 50 and the adjustment layer 53.

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