发明名称 FRAME HAVING FRAME BLADES THAT PARTICIPATE IN COOLING MEMORY MODULES
摘要 A frame has frame blades arranged to be interleaved with memory modules or memory module sockets. The frame blades participate in cooling the memory modules when memory modules are installed.
申请公布号 US2012020004(A1) 申请公布日期 2012.01.26
申请号 US200913260207 申请日期 2009.10.30
申请人 RAU TIMOTHY;SIMON GLENN C.;HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 发明人 RAU TIMOTHY;SIMON GLENN C.
分类号 G06F1/20 主分类号 G06F1/20
代理机构 代理人
主权项
地址