发明名称 |
FRAME HAVING FRAME BLADES THAT PARTICIPATE IN COOLING MEMORY MODULES |
摘要 |
A frame has frame blades arranged to be interleaved with memory modules or memory module sockets. The frame blades participate in cooling the memory modules when memory modules are installed.
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申请公布号 |
US2012020004(A1) |
申请公布日期 |
2012.01.26 |
申请号 |
US200913260207 |
申请日期 |
2009.10.30 |
申请人 |
RAU TIMOTHY;SIMON GLENN C.;HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
RAU TIMOTHY;SIMON GLENN C. |
分类号 |
G06F1/20 |
主分类号 |
G06F1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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