MICROELECTRONIC ELEMENTS WITH REAR CONTACTS CONNECTED WITH VIA FIRST OR VIA MIDDLE STRUCTURES

摘要

A microelectronic unit, microelectronic element, e g, an integrated circuit chip, having a semiconductor region of monocrystalline form. The semiconductor region has a front surface extending in a first direction, an active circuit element adjacent the front surface, a rear surface remote from the front surface and a conductive which extends towards the rear surface The conductive can be insulated from the semiconductor region by an inorganic dielectric layer An opening can extend from the rear surface partially through a thickness of the semiconductor region, with the opening and the conductive via having respective widths, in the first direction The width of the opening may be greater than the width of the conductive via where the opening meets the conductive via A rear contact can be electrically connected to the conductive and exposed at the rear surface for electrical connection with an external circuit element.