| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor package structure capable of ensuring vibration insulating function of a semiconductor chip, reducing the number of components and improving the assembling performance as a semiconductor package. <P>SOLUTION: A semiconductor package 10 housing a semiconductor chip 12 consists of a package body 14 housing the semiconductor chip 12 therein, and vibration insulating parts 16 integrated with the package body 14 and elastically supporting the semiconductor chip 12 on the package body 14. The semiconductor chip 12 is adhered and held on a part of the vibration insulating parts 16, or is held and fixed between two vibration insulating parts 16 by elastic force. <P>COPYRIGHT: (C)2012,JPO&INPIT |
