| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed circuit board capable of manufacturing a printed circuit board accurately even when a part of a through-hole is plated. <P>SOLUTION: Firstly, a conductive hole is provided in a first multilayer substrate constituted by laminating a metal foil or a core substrate and prepreg for interlayer connection. Secondly, a wall surface inside the conductive hole is plated. Thirdly, a resin is filled into the conductive hole. Fourthly, lid-plating is applied to the conductive hole so as to block the resin-filled conductive hole. Fifthly, a second multilayer substrate is laminated on one surface of the first multilayer substrate. Sixthly, a through-hole penetrating from the first multilayer substrate to the second multilayer substrate is provided so that the plated portion surrounds the through-hole. Finally, the resin filled into the conductive hole is removed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
