METHOD OF MANUFACTURING SINGLE SIDED CIRCUIT BOARD BY USING CARRIER GLUE FILM AND JUXTAPOSITION FLAT WIRING

摘要

A method of manufacturing a single sided circuit board by using a carrier glue film and juxtaposition flat wirings (2). The juxtaposition flat wirings (2) are bonded together by the carrier glue film without transferring the adhesive. The position of the flat wirings which needs to be disconnected is cut off. The flat wirings are formed on a circuit board substrate (1) with strong adhesion by hot-pressing. The carrier film is removed. A solder resist layer (3) is formed by printing a solder resist ink or hot pressing a coating film with pad openings. A bridge connection is formed by printing a conductive ink or soldering a conductor (7, 10). A hole is formed by drilling or punching with punch die in the position of welding spot in order to weld and install a jack component. The circuit board can be produced by the manufacturing method without etch, and the method is a green, energy-saving and material saving technology.