发明名称 PACKAGE, LIGHT UNIFORMIZATION STRUCTURE, AND BACKLIGHT MODULE USING SAME
摘要 Provided are a package, a light uniformization structure, and a backlight module using same. The package helps improving uniformity of light and includes a multi-lateral transparent body, which has a top face and lateral faces, which are all planar surfaces. The transparent body has a bottom face in which a semispherical cavity is formed and extends inward into the body. With the package capped over a light-emitting diode with semispherical cavity set to correspond to the light-emitting diode, the light shape and the energy of light from the light-emitting diode is re-distribution and utilized by the package to thereby provide a light uniformization structure that shows high brightness, high performance, and high uniformity of light. One or a plurality of such light uniformization structures can be provided on a backlight module to enhance light uniformity for a displaying panel.
申请公布号 US2012020053(A1) 申请公布日期 2012.01.26
申请号 US20100840282 申请日期 2010.07.20
申请人 CHEN JIN-JIA;CHENG KAI-HUNG;HUANG KUANG-LUNG 发明人 CHEN JIN-JIA;CHENG KAI-HUNG;HUANG KUANG-LUNG
分类号 G02F1/13357;F21V11/00;H01L33/46 主分类号 G02F1/13357
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