MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED INDUCTANCE

摘要

A microelectronic assembly (100) includes a semiconductor chip (110) having chip contacts (112) exposed at a first face and a substrate (130) juxtaposed with a face (128) of the chip (110). A conductive bond element (144) can electrically connect a first chip contact (112) with a first substrate contact (132) of the substrate, and a second conductive bond element (146) can electrically connect the first chip contact (112) with a second substrate contact. The first bond element (144) can have a first end (144A) metallurgically joined to the first chip contact (112) and a second end (144B) metallurgically joined to the first substrate contact (132). A first end (246A, 346A) of the second bond element (146) can be metallurgically joined to the first bond element (144).