发明名称 Bonded intermediate substrate and method of making same
摘要 An intermediate substrate includes a handle substrate bonded to a thin layer suitable for epitaxial growth of a compound semiconductor layer, such as a III-nitride semiconductor layer. The handle substrate may be a metal or metal alloy substrate, such as a molybdenum or molybdenum alloy substrate, while the thin layer may be a sapphire layer. A method of making the intermediate substrate includes forming a weak interface in the source substrate, bonding the source substrate to the handle substrate, and exfoliating the thin layer from the source substrate such that the thin layer remains bonded to the handle substrate.
申请公布号 US8101498(B2) 申请公布日期 2012.01.24
申请号 US20060408239 申请日期 2006.04.21
申请人 发明人 PINNINGTON THOMAS HENRY;ZAHLER JAMES M.;PARK YOUNG-BAE;TSAI CHARLES;LADOUS CORINNE;ATWATER, JR. HARRY A.;OLSON SEAN
分类号 H01L21/30;H01L21/46;H01L33/00;H01L33/14;H01L33/32;H01L33/40 主分类号 H01L21/30
代理机构 代理人
主权项
地址