发明名称 Electronic component mounting apparatus
摘要 The invention prevents reduction of a pickup rate even when a storage tape in use and a new storage tape are connected to each other with a connection tape. A component recognition camera takes an image of an electronic component held by a suction nozzle, and a recognition processing device performs recognition processing. When a positional shifting amount calculated by CPU based on the recognition processing result is more thanα, a board recognition camera takes an image of a storage portion of a storage tape storing a next electronic component to be picked up. When a positional shifting amount of the storage portion calculated based on the recognition processing result is more thanβ, the CPU enables seam passage processing. Based on the image taking of the storage portion by the board recognition camera and the recognition processing by the recognition processing device which are performed each time the storage tape is fed N times, the CPU controls correction of a pickup position.
申请公布号 US8099860(B2) 申请公布日期 2012.01.24
申请号 US20080036735 申请日期 2008.02.25
申请人 WATANABE AKIO;IMOTO TAKUYA;FUKUSHIMA YOSHIHARU;HITACHI HIGH-TECH INSTRUMENTS CO., LTD. 发明人 WATANABE AKIO;IMOTO TAKUYA;FUKUSHIMA YOSHIHARU
分类号 B23P19/00 主分类号 B23P19/00
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