Method of polishing a patterned semiconductor substrate

摘要

A porous polishing pad is useful for polishing semiconductor substrates. The porous polishing pad (100) has a porous matrix formed from a coagulated polyurethane and a non-fibrous polishing layer (120). The non-fibrous polishing layer (120) has a polishing surface with a pore count of at least 500 pores per mm<2> that decreases with removal of the polishing layer; and the polishing surface has a surface roughness Ra between 0.01 and 3 mu m.