| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electric power conversion device capable of efficiently cooling a semiconductor device. <P>SOLUTION: An electric power conversion device 1 is constituted by stacking a plurality of semiconductor modules 2 in which semiconductor elements 21 are installed. The semiconductor module 2 comprises a semiconductor element 21, a radiator plate 22, a sealing part 23, a wall part 24 and a penetration refrigerant channel 41. A plurality of semiconductor modules 2 are stacked, a lid part 3 is provided on both sides in a stacking direction, and a lateral refrigerant channel 42 communicating with the penetration refrigerant channel 41 and along the radiation surface 221 is formed between adjacent semiconductor modules 2 and between the lid part 3 and the semiconductor module 2 inside the wall part 24. At least one of a plurality of semiconductor modules 2 has a cross-sectional area of channel of the penetration refrigerant channel 41 different from that of other semiconductor modules 2. <P>COPYRIGHT: (C)2012,JPO&INPIT |
