| 摘要 |
The present invention relates to a method of manufacturing a temporary substrate, the temporary substrate thus produced, and a method of using the temporary substrate for transfer of a thin layer from an original substrate to a final substrate. The temporary substrate has a principle part of the original substrate and a surface layer thereon that includes a plurality of inserts formed of a material having a coefficient of thermal expansion different from that of the material constituting the rest of the surface layer. When exposed to heat treatment, these inserts form detachment zones between the upper face of an attached thin layer and the temporary substrate. |
