| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat dissipation device that achieves a fall of heat resistance, reduction of manufacturing cost, and simple assembly, and a method of manufacturing the same. <P>SOLUTION: The heat dissipation device 1 includes a heat dissipating unit 11 and at least one heat pipe 12. At least one recessed tank 114 having an opening 1141 and blockaded side 1142 is disposed in shape of subsidence on an end surface 113 forming a heat absorbing part 112 of the heat dissipation unit 11. Further, a heat absorbing end 121 of the heat pipe 14 is inserted to set up in the corresponding recessed tank 114, and a heat dissipating end 122 of the heat pipe 14 is disposed by allowing the same to be inserted a through-hole formed in a heat dissipating part 111 of the heat dissipating unit 11. In this case, a heat conduction surface 1212 of the heat pipe 14 is tightly adhered according to the blockaded side 1142 of the recessed tank 114, and the heat absorbing surface 1211 of the heat pipe 14 is set up so that the same may be flat to an end surface 113 of the heat dissipation unit 11. <P>COPYRIGHT: (C)2012,JPO&INPIT |
