发明名称 CONDUCTIVE CIRCUIT INTEGRATED MOLDED PRODUCT AND METHOD OF MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a conductive circuit integrated molded product that prevents a lead from being peeled or broken, or a conductive circuit from being corroded without increasing the number of components and manufacturing steps. <P>SOLUTION: The conductive circuit integrated molded product includes a resin molded body, a base film embedded in the resin molded product so as to be flush with one surface of the resin molded body, the conductive circuit disposed between the resin molded body and the base film, and the lead for electrically connecting the conductive circuit to an external device. The one end part of the lead is electrically connected to a part of the conductive circuit while being embedded in the resin molded product, and the other end part of the lead is exposed to the external part of the resin molded product. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012011691(A) 申请公布日期 2012.01.19
申请号 JP20100151141 申请日期 2010.07.01
申请人 NISSHA PRINTING CO LTD 发明人 YAMAZAKI SEIICHI
分类号 B29C45/14;B29C45/26 主分类号 B29C45/14
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