| 摘要 |
Embodiments extend the capability of fuse elements, anti-fuse elements, and combinations thereof to enable multi-time programmable memory elements. Accordingly, embodiments significantly reduce area requirements and control circuitry complexity of memory elements. Embodiments can be used in non-volatile memory storage, for example, and are suitable for use in system on chip (SoC) products.
A memory element is provided and comprises a first terminal (N1) coupled to an N-doped region and a second terminal (N2) coupled to a P-doped region. The N-doped and P-doped regions form a polysilicon diode anti-fuse. A silicide layer connects the doped regions and forms a fuse in parallel with the anti-fuse. |
