| 摘要 |
PURPOSE: A multi-chip package apparatus with a chip address circuit is provided to be not affected by lead arrangement not using a lead in which an external ground power supply is applied. CONSTITUTION: An external power voltage is applied to a lead(310). A pad circuit(320) initializes an inner node to the level of ground power supply. The pad circuit controls the electric potential of the inner node. The pad circuit outputs chip address information. The chip address circuit includes an internal circuit(330). The internal circuit receives the chip address information. The internal circuit uses the chip address information as a chip address. |
