发明名称 Fuse part in semiconductor device and method for forming the same
摘要 A fuse part in a semiconductor device has a plurality of fuse lines extended along a first direction with a given width along a second direction. The fuse part includes a first conductive pattern having a space part formed in a fuse line region over a substrate, wherein portions of the first conductive pattern are spaced apart by the space part along the first direction. The fuse part includes a first insulation pattern formed over the space part, the first insulation pattern having a width smaller than a width of the first conductive pattern along the second direction and a thickness greater than a thickness of the first conductive pattern, and a second conductive pattern formed over the first insulation pattern, the second conductive pattern having a width greater than the width of the first insulation pattern along the second direction.
申请公布号 US8097931(B2) 申请公布日期 2012.01.17
申请号 US20080344174 申请日期 2008.12.24
申请人 LEE BYUNG-DUK;HYNIX SEMICONDUCTOR INC. 发明人 LEE BYUNG-DUK
分类号 H01L23/52 主分类号 H01L23/52
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