发明名称 |
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SUBSTRATES FOR SEMICONDUCTOR ELEMENTS |
摘要 |
Provided is a manufacturing method of a substrate for a semiconductor element including the steps of: providing a first photosensitive resin layer on a first surface of a metal plate; providing a second photosensitive resin layer on a second surface different from the first surface of the metal plate; forming a first etching mask for forming a connection post on the first surface of the metal plate; forming a second etching mask for forming a wiring pattern on the second surface of the metal plate; forming the connection post by performing an etching from the first surface to a midway of the metal plate; filling in a premold resin to a portion of the first surface where the connection post does not exist; processing so that a height of the connection post of the first surface is lower than a height of the premold resin surrounding the connection post; and forming the wiring pattern by performing an etching on the second surface. |
申请公布号 |
KR20120005446(A) |
申请公布日期 |
2012.01.16 |
申请号 |
KR20117022638 |
申请日期 |
2010.03.17 |
申请人 |
TOPPAN PRINTING CO., LTD. |
发明人 |
MANIWA SUSUMU;TSUKAMOTO TAKEHITO;TODA JUNKO |
分类号 |
H01L23/50;H01L21/60;H01L23/12 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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