发明名称 LASER SCRIBING APPARATUS, LASER SCRIBING METHOD, LASER CUTTING METHOD, AND BREAKING APPARATUS
摘要 PURPOSE: A method for scribing and cutting using laser is provided to precisely form a scribing line by perpendicularly jetting a laser beam in the surface of a processing object. CONSTITUTION: A method for scribing and cutting using laser comprises as follows. A first scribing line(SL1) for cutting which includes a curved portion is formed by giving thermal stress. The thermal stress is made by emitting laser beam to a target using a laser head(100). A laser beam is emitted to n the processing object using the laser head in order to make the thermal stress. One or more second scribing line(SL2) for the stress relief is formed. The laser beam is emitted to the processing object in order to form a third scribing line(SL3) is on the outside of the first scribing line. The second scribing line is expanded to the edge of the processing object. The second scribing line is expanded to the third scribing line.
申请公布号 KR20120004793(A) 申请公布日期 2012.01.13
申请号 KR20100065471 申请日期 2010.07.07
申请人 EO TECHNICS CO., LTD. 发明人 JEON, EUN SUK;PARK, SANG YOUNG;KIM, HYUN GUK
分类号 B23K26/38;B23K26/082;C03B33/033;C03B33/04 主分类号 B23K26/38
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