WAFER DICING BLADE AND WAFER DICING APPARATUS COMPRISING THE SAME

摘要

PURPOSE: A wafer dicing blade and a wafer dicing apparatus comprising the same are provided to reduce manufacturing cost by reducing the width of the cutting region and the scribe lane formed in a wafer. CONSTITUTION: A wafer dicing blade(200) comprises a cutting part(100) and a supporting part(110). The cutting part is formed into a ring-shape. The cutting part comprises a protrusion(105) which is protruded from one side of the supporting part. A protrusion(105) comprises a domain(107) having a uniform width(H2). The supporting part surrounds the both sides or internal side of the cutting part The length(H1) of protrusion is from the end of the supporting part to the end of the protrusion.