发明名称 SEMICONDUCTOR INSULATING FILM COMPOSITION CONTAINING POLYORGANOSILSESQUIOXANE HAVING METHACRYLOXY GROUP OR ACRYLOXY GROUP
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor insulating film composition containing a polyorganosilsesquioxane having a methacryloxy group or an acryloxy group and a method for producing a thin film using the semiconductor insulating film composition, and an insulating film produced by the method and exhibiting resistance against an organic solvent. <P>SOLUTION: A semiconductor insulating film composition is prepared by adding a vinyl monomer and a polymerization initiator to a polyorganosilsesquioxane having a methacryloxy group or an acryloxy group. After the semiconductor insulating film composition is coated by a spin coating method or the like, radical polymerization of a vinyl group is performed with heating or an ultraviolet irradiation. Subsequently, the semiconductor insulating film composition is compositely cured by condensation polymerization of an alkoxy group to produce a silicone insulating film (polysilsesquioxane film). <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012009796(A) 申请公布日期 2012.01.12
申请号 JP20100156217 申请日期 2010.06.22
申请人 KONISHI KAGAKU IND CO LTD;WAKAYAMA UNIV;MURORAN INSTITUTE OF TECHNOLOGY 发明人 NAKAHARA YOSHIO;KIMURA KEIICHI;FUKUDA HISASHI;KUMEI MAKI;YAMAMOTO HIROYUKI;OI FUMIO
分类号 H01L21/312;C08G77/20;C08G77/50;C09D4/00;C09D5/25;C09D7/12;C09D183/07;C09D183/10 主分类号 H01L21/312
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