| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat radiation package as a semiconductor device which effectively radiates heat from a semiconductor element and ensures fluidity and repletion of an encapsulation resin. <P>SOLUTION: A BGA type semiconductor device comprises a substrate 1 provided with wires and electrodes, a semiconductor element 2 of a rectangular plane shape having a plurality of electrodes provided along edges of the rectangle is disposed on the substrate 1, wires 4 for respectively connecting the electrodes of the semiconductor element 2 and the electrodes on the substrate 1, a heat radiation member 11 disposed on the substrate 1 to cover the semiconductor element 2 and having an opening 16 in a region facing top portions of a plurality of wires 4 connected to the electrodes along edges of the semiconductor element 2, and an encapsulation resin 20 for covering and encapsulating the semiconductor element 2 and the heat radiation member 11. <P>COPYRIGHT: (C)2012,JPO&INPIT |
