| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting module capable of preventing a wiring pattern from becoming high resistance, hardly disrupting reflection of light at a module substrate side, and improving a light extraction efficiency at low cost. <P>SOLUTION: A wiring pattern 25 for positive electrode and a wiring pattern 26 for negative electrode of a light emitting module 21 are made principally of Ag, and are provided on a module substrate 22 as light reflecting surfaces. A plurality of semiconductor light emitting elements 45 are mounted on the substrate, and these elements and wiring patterns are electrically connected with each other via bonding wires 47 to 52. A sealing resin 57 is provided on the substrate, and seals each of the light emitting elements, each part of wiring patterns and bonding wires. A part of wiring patterns not sealed with the resin, contains a feeding pad part. A protective layer 37 is coated on the unsealed part except the pad part out of the sealing resin so as to be limited as large as a periphery of the part. <P>COPYRIGHT: (C)2012,JPO&INPIT |
