WIRING BOARD FORMATION METHOD, AND WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a wiring board formation method and the like capable of significantly reducing labor and cost for manufacturing a wiring board, by forming a decoupling capacitor at the same time a wiring pattern is formed.

SOLUTION: The wiring board formation method includes steps of: forming cylindrical via insulation parts 3a and 3b and via conduction parts 4a and 4b on a silicon substrate 2; forming an induction part 5a by extending an insulation material which is laminated on a peripheral region of the via conduction part 4a to be connected to a tubular end part of the via insulation part 3a across the entire circumference; forming an insulation part 5b by extending the insulation material laminated in the peripheral region of the via conduction part 4b so that a portion does not come in contact with the tubular end part of the via insulation part 3b; and forming wiring parts 6a and 6b which are connected to the via conduction parts 4a and 4b while being laminated on surfaces of the induction part 5a and the insulation part 5b. The wiring part 6a is connected to a power source, the wiring part 6b is connected to the ground, and then the wiring part 6a and the silicon substrate 2 sandwich the induction part 5a to form a capacitor.

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