| 摘要 |
Disclosed is a substrate processing apparatus in which a liquid state raw material is maintained at a high-temperature and high-pressure fluid state by a cooling mechanism at a first raw material receiving unit, a supplying valve of a raw material supplying path is opened to provide the high-temperature and high-pressure fluid to a processing chamber where a target substrate is disposed, and the target substrate is dried by the high-temperature and high-pressure fluid. A second raw material receiving unit is cooled down below a condensation temperature of the raw material by a second cooling mechanism, the high-temperature and high-pressure fluid in the processing chamber is collected at the second raw material receiving unit by opening a collecting valve. The collected raw material is re-utilized as a raw material supplied from the first raw material receiving unit to the processing chamber. |
