| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a compact resin-encapsulation type electronic control device having a restricted plane area and volume, capable of expanding a circuit component mounting area without expanding the plane area of an electronic substrate. <P>SOLUTION: In the resin-encapsulation type electronic control device, a support member 20A includes: a first support plate 21a; a second support plate 22a; and a pair of rising portions 23a forming a space portion together with a first electronic substrate 30A and a second electronic substrate 40A. An exterior material 11 is configured of a melted synthetic resin injected into inside and outside of the space portion along the pair of rising portions 23a. An internal circuit component 33 enters into a window hole formed on the support member 20A and faces the opposite first electronic substrate 30A or the second electronic substrate 40A with a gap. <P>COPYRIGHT: (C)2012,JPO&INPIT |
