发明名称 |
RESIN COMPOSITION, PHOTOSENSITIVE FILM, METHOD FOR FORMING RESIST PATTERN, AND PRINTED WIRING BOARD |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition which can secure a sufficient flame retardancy, can provide a sufficient resolution by an alklaline developer, can provide a cured material having a sufficient elongation, and sufficiently reduced in the bleed-out problem. <P>SOLUTION: The resin composition contains 10 to 80 mass% of a phosphorus-containing compound having a repeating unit represented by formula (1), and a bismaleimide compound or a blocked isocyanate compound as a thermosetting agent. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012007182(A) |
申请公布日期 |
2012.01.12 |
申请号 |
JP20110200731 |
申请日期 |
2011.09.14 |
申请人 |
HITACHI CHEM CO LTD |
发明人 |
MORITA MASAKI;HATAKEYAMA SHUICHI;ARIGA SHIGEHARU;MASUDA KATSUYUKI |
分类号 |
C08F2/44;C08F230/02;G03F7/004;G03F7/028;H05K3/28 |
主分类号 |
C08F2/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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