发明名称 RESIN COMPOSITION, PHOTOSENSITIVE FILM, METHOD FOR FORMING RESIST PATTERN, AND PRINTED WIRING BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a resin composition which can secure a sufficient flame retardancy, can provide a sufficient resolution by an alklaline developer, can provide a cured material having a sufficient elongation, and sufficiently reduced in the bleed-out problem. <P>SOLUTION: The resin composition contains 10 to 80 mass% of a phosphorus-containing compound having a repeating unit represented by formula (1), and a bismaleimide compound or a blocked isocyanate compound as a thermosetting agent. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012007182(A) 申请公布日期 2012.01.12
申请号 JP20110200731 申请日期 2011.09.14
申请人 HITACHI CHEM CO LTD 发明人 MORITA MASAKI;HATAKEYAMA SHUICHI;ARIGA SHIGEHARU;MASUDA KATSUYUKI
分类号 C08F2/44;C08F230/02;G03F7/004;G03F7/028;H05K3/28 主分类号 C08F2/44
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