| 摘要 |
<P>PROBLEM TO BE SOLVED: To correct warpage of a circuit board in a semiconductor device and in a method of manufacturing the same. <P>SOLUTION: A semiconductor device comprises: a circuit board 1 in which a first primary surface 1a includes first electrodes 2; a semiconductor element 6 that is provided so as to face the primary surface 1a and is connected to the first electrodes 2 via first terminals 5; and an encapsulation resin 23 that is filled between the primary surface 1a and the semiconductor element 6 and covers peripheral side surfaces 6a of the semiconductor element 6. Peripheral side surfaces 23x of the encapsulation resin 23 are perpendicular to the primary surface 1a of the circuit board 1. <P>COPYRIGHT: (C)2012,JPO&INPIT |
