发明名称 MASK FOR FORMING INTEGRATED CIRCUIT
摘要 A method of forming an integrated circuit includes providing a buffer layer comprising a dielectric material above a layer of conductive material and providing a layer of mask material above the buffer layer. The mask material comprises amorphous carbon. The method also includes removing a portion of the buffer layer and the layer of mask material to form a mask. A feature is formed in the layer of conductive material according to the mask.
申请公布号 US2012007221(A1) 申请公布日期 2012.01.12
申请号 US201113241810 申请日期 2011.09.23
申请人 HUANG RICHARD J.;BELL SCOTT A.;DAKSHINA-MURTHY SRIKANTESWARA;FISHER PHILIP A.;NGUYEN RICHARD C.;TABERY CYRUS E.;YOU LU;GLOBALFOUNDRIES INC. 发明人 HUANG RICHARD J.;BELL SCOTT A.;DAKSHINA-MURTHY SRIKANTESWARA;FISHER PHILIP A.;NGUYEN RICHARD C.;TABERY CYRUS E.;YOU LU
分类号 H01L29/66;C23F1/00 主分类号 H01L29/66
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