| 摘要 |
Disclosed is a laminated wiring board which suppresses position slippage of electronic components, said components being implant members such as prepregs that have been sandwiched and built-in between two substrates, and which can increase the electrical connection reliability between the electrodes of the electronic components and external electrodes connected thereto. A conductor circuit (6), formed on a first substrate (1), and a resistor (3A), which is an electronic component, are connected via at least two conductive material (8) sections for each one electrode (13) of the resistor (3A) which is an electronic component. The conductive material (8) is composed of a conductive paste filled into via holes (7) formed on the first substrate (1). The conductive materials (8) are provided beside one another in a straight line in the short-side direction, which is the direction perpendicular to the lengthwise direction of the resistor (3A), and are provided in positions symmetrical to the axial core (C) in the lengthwise direction of the resistor (3A). |
