| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a flow passage selector which can reduce the number of drive mechanisms to select a flow passage, and to provide a liquid processing device which can reduce the number of drive mechanisms to select a dedicated discharge passage for processing fluids which process bodies to be processed. <P>SOLUTION: An atmosphere in a liquid processing unit 3, which performs processing by supplying multiple kinds of processing fluids to a wafer W by different timings, is discharged from the liquid processing unit 3 through an exhaust path 35 and a flow path selection part 5 to multiple dedicated discharge passages (flow passages for connection) 61 to 63. The flow passage selection part 5 comprises an external cylinder 51 and a rotary cylinder 53 provided in the external cylinder, and three openings 53a to 53c of the rotary cylinder 53 are positioned so as to have a state where one pair out of three connection ends 51a to 51c of the external cylinder 51 and the openings 53a to 53c of the rotary cylinder 53 respectively corresponding to and paired with each other is overlapped to communicate while the other pairs do not communicate, in which each pair takes turns in order while the rotary cylinder 53 is rotating. <P>COPYRIGHT: (C)2012,JPO&INPIT |
