| 发明名称 |
INSULATING RESIN COMPOSITION AND PRINTED CIRCUIT SUBSTRATE USING THE SAME |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an insulating resin composition containing a soluble fluorine-based resin and a printed circuit board manufactured using the same. <P>SOLUTION: The insulating resin composition includes: a soluble fluorine-based resin; a thermosetting resin; and a solvent capable of simultaneously dissolving the soluble fluorine-based resin and the thermosetting resin. In addition, the printed circuit board using the same is disclosed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
| 申请公布号 |
JP2012007150(A) |
申请公布日期 |
2012.01.12 |
| 申请号 |
JP20110103436 |
申请日期 |
2011.05.06 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
CHO JAE CHOON;JUNG HYUNGMI;LEE CHOON KEUN |
| 分类号 |
C08L101/12;C08K3/00;C08K5/10;C08K5/17;C08L27/16;H05K1/03;H05K3/46 |
主分类号 |
C08L101/12 |
| 代理机构 |
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