| 发明名称 |
SOFT POLISHING PAD FOR POLISHING A SEMICONDUCTOR SUBSTRATE |
| 摘要 |
Soft polishing pads for polishing semiconductor substrates are described. A soft polishing pad includes a molded homogeneous polishing body having a thermoset, closed cell polyurethane material with a hardness approximately in the range of 20 Shore D to 45 Shore D.
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| 申请公布号 |
US2012009855(A1) |
申请公布日期 |
2012.01.12 |
| 申请号 |
US20100832908 |
申请日期 |
2010.07.08 |
| 申请人 |
ALLISON WILLIAM;SCOTT DIANE;KERPRICH ROBERT;HUANG PING;FRENTZEL RICHARD |
发明人 |
ALLISON WILLIAM;SCOTT DIANE;KERPRICH ROBERT;HUANG PING;FRENTZEL RICHARD |
| 分类号 |
B24D11/00;B24D3/32;B24D13/14 |
主分类号 |
B24D11/00 |
| 代理机构 |
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代理人 |
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