| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a sealing agent for a semiconductor device, which is excellent in storage stability and low-temperature/speed curableness, in which a cured material is useful for an underfill material rigid at room temperature and having repair performance and rework performance, and which improves the drop resistance of a compact electronic apparatus. <P>SOLUTION: The sealing material for mounting the semiconductor device contains: (A) 100 pts.mass of a liquid epoxy resin having two or more epoxy groups in one molecular; (B) a liquid phenol resin containing an alkenyl group; (C) 1.5 to 50 pts.mass of a micro-capsulated curing accelerator as an effective component; (D) a reactive diluent composed of an epoxy component having one epoxy group in one molecular; and (E) 0 or more pts.mass of an inorganic filler. The sealing material is composed of an insoluble composition, wherein a mol ratio of all epoxy groups in the composition to a phenol hydroxy group in the (B) component is 1.3 to 3.0. The sealing material is used for mounting the semiconductor device including: a base board, and an element mounted on the base board. <P>COPYRIGHT: (C)2012,JPO&INPIT |
