METHOD FOR VISION INSPECTING SEMICONDUCTOR PACKAGES

摘要

The present invention relates to a method for vision inspecting semiconductor packages. The method for vision inspecting semiconductor packages according to the present invention is a method for vision inspecting a semiconductor package in an apparatus for manufacturing the semiconductor package including: a table having the inspection target semiconductor packages put thereon; a picker including a plurality of pick-up members allowing gap adjustment and the fixing of the semiconductor package; and a vision camera shooting the semiconductor package fixed by the picker. The method includes the steps of: (a) picking up, by the picker, a plurality of semiconductor packages on a table in a state where the space between the pick-up members of the picker is a first pitch; (b) varying the space between the pick-up members of the picker to a second pitch smaller than the first pitch; and (c) shooting, by the vision camera, the semiconductor packages fixed by the picker, wherein the picker and the vision camera move relative to each other without pause.