发明名称 |
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
A wiring board has a first resin insulation layer, a first conductive pattern formed on the first resin insulation layer, a second resin insulation layer formed on the first conductive pattern and having an opening portion exposing at least a portion of the first conductive pattern, a second conductive pattern formed on the second resin insulation layer, and a via conductor formed in the opening portion of the second resin insulation layer and electrically connecting the first conductive pattern and the second conductive pattern. The via conductor has a side surface extending between the first conductive pattern and the second conductive pattern and a bent portion where an inclination of the side surface of the via conductor changes in a depth direction of the via conductor.
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申请公布号 |
US2012008295(A1) |
申请公布日期 |
2012.01.12 |
申请号 |
US201113174837 |
申请日期 |
2011.07.01 |
申请人 |
OUCHI SHINJI;YAMADA SHIGERU;TERUI MAKOTO;SHIZUNO YOSHINORI;IBIDEN CO., LTD. |
发明人 |
OUCHI SHINJI;YAMADA SHIGERU;TERUI MAKOTO;SHIZUNO YOSHINORI |
分类号 |
H05K1/18;H05K1/11;H05K3/42 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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