| 摘要 |
A manufacturing method of LED integrated structure includes molding a heat radiating substrate (1,50,100,200,251,401,450,500), molding a patterned circuit conductive layer (7,55,107,212,214,216,218,220,222,407,455,507), molding plastic members for positioning lenses or molding lenses, fixing the chips, electrically connecting the LED chips (3,51,110,208,209,210,403,451,510) with the printed circuit conductive layer (7,55,107,212,214,216,218,220,222,407,455,507), and encapsulating the LED chips (3,51,110,208,209,210,403,451,510) and leads (54,454). The manufacturing method has simple process and low manufacturing cost, and the manufactured LED integrated structure has good heat radiation, precise position relation of the lenses and the chips, high luminous flux, and good optical effect. |
