发明名称 |
Method of grinding semiconductor wafers, grinding surface plate, and grinding device |
摘要 |
A method of grinding semiconductor wafers including simultaneously grinding both surfaces of multiple semiconductor wafers by rotating the wafers between a pair of upper and lower rotating surface plates in a state where the wafers are held on a carrier so that centers of the wafers are positioned on a circumference of a single circle, wherein a ratio of an area of a circle passing through the centers of the wafers to an area of one of the wafers is greater than or equal to 1.33 but less than 2.0; surfaces of the fixed abrasive grains comprised in the surface plates are comprised of pellets disposed in a grid-like fashion, with the pellets provided in a center portion and pellets provided in a peripheral portion being larger in size than the pellets provided in an intermediate portion. |
申请公布号 |
US8092277(B2) |
申请公布日期 |
2012.01.10 |
申请号 |
US20090470714 |
申请日期 |
2009.05.22 |
申请人 |
HASHII TOMOHIRO;YAMADA YASUNORI;KAKIZONO YUICHI;SUMCO CORPORATION |
发明人 |
HASHII TOMOHIRO;YAMADA YASUNORI;KAKIZONO YUICHI |
分类号 |
B24B1/00;B24B7/04;B24B7/10;B24B7/17;B24B37/08;H01L21/304 |
主分类号 |
B24B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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