SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

摘要

PURPOSE: A semiconductor package and a manufacturing method thereof are provided to control wet conditions between electric conduction materials by mechanically connecting a first substrate and a second substrate. CONSTITUTION: A first pad is electrically connected to the semiconductor chip of a first substrate(100). An insulating layer is used in order to partly cover both sides of the first pad. A recess which exposes the first pad is formed on the insulating layer. The first pad is exposed by partly etching the top of the first substrate. One side of a second substrate(120) is faces one side of the first substrate. A second pad(122) is formed to be contiguous to the one side of the second substrate. An insulating pattern having a first opening which exposes the second pad is formed in one side of the second substrate. The width and height of a second opening is same as the width and height of the first opening.