发明名称 ETCHANT AND ETCHING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide an etchant for copper oxide and an etching method, wherein when copper oxide, particularly CuO (II), as a thermal reaction type resist material is exposed to a laser beam, the etchant can selectively etch the exposed and unexposed parts thereof. <P>SOLUTION: A copper oxide-containing layer essentially comprising copper oxide is etched with an etchant at least containing either an acid or a chelating agent and a surfactant containing a phosphoric ester moiety. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012001757(A) 申请公布日期 2012.01.05
申请号 JP20100137117 申请日期 2010.06.16
申请人 ASAHI KASEI CORP 发明人 NAKATA TAKUTO;NAKAGAWA YOSHIKIYO
分类号 C23F1/18 主分类号 C23F1/18
代理机构 代理人
主权项
地址