| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a notch positioning type wire bonding structure and a method for preventing displacement of lead pins capable of improving manufacturing efficiency and reducing manufacturing cost. <P>SOLUTION: In the notch positioning type wire bonding structure, a plurality of bonding pads 3 are arranged on a circuit board 5. The bonding pads 3 join an electronic component 1 with a surface mounting technology having a plurality of lead pins 11, are larger than the lead pins 11, and are located on the arrangement direction 4 of the circuit board 5. At least two bonding pads 3 are provided with at least one notch 21 respectively, located at parts corresponding to outer areas of the lead pins 11 so as to position peripheral edges of the lead pins 11 and to prevent the displacement of the lead pins. <P>COPYRIGHT: (C)2012,JPO&INPIT |
